This Lunch & Learn with Jon Buchwald will demonstrate how a novel use of solder spheres as an attachment mechanism for a unique board level EMI shield solves many of the short comings of traditional, board level shielding cans.
Specifically, XGR’s solder sphere system addresses the inability to inspect and re-work, poor co-planarity, and penalizing board real estate requirements. The result is an extremely rugged, durable, and lightweight board level shielding solution.
Jon Buchwald joined XGR Technologies to run the Sales and Marketing department and bring SnapShot® technology to the broader market. Jon comes to XGR after 22 years at W.L. Gore & Associates where he held positions in engineering, new product development, new business development, and business leadership. His educational background includes a Bachelor’s degree in Mechanical Engineer and a Master’s degree in Business Administration.
Register in advance for this meeting:
https://us06web.zoom.us/meeting/register/tZYuc-qqrjwqEte32PbzW_-IeH3dVOwP6DRZ
After registering, you will receive a confirmation email containing information about joining the meeting.